Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via

Immersion Gold Multilayer Circuit Board PCB Plated Through Hole Tg 170 Blind Via

Product Parameter

Advantages

a) 94V0 flame retardant fiber.

b) High Tg material reliable.

c)?Excellent solderability on gold flat surface

d) No minimum quantity required for buyers.

More Applications in electronics

Wlan Antenna
Car Inverters
Solar Power Inverters
Remote I/O
Interface Module

PCB knowledge: The Difficulty Factors for Multilayer boards

Multilayer PCB’s represent one of the most complicates products in PCB industry. In order to design producible multilayer PCB’s, it is imperative that PCB designers understand the processes and difficulty factors

*Build-up

The more layers in a multilayer PCB’s, the greater risk of mis-registration during laminate process. The difficulty factor, therefore, increase with an increasing layer counts.

*Core thickness of rigid inner laminates

Inner layers are normally based on thin rigid laminate cores with copper cladding. The thinner the rigid laminates, the more difficult they are to handle, for example, in the etching process.

*Thickness tolerance (total thickness inclusive of copper foils)

The difficulty factor and the rejection rate depend very much upon the thickness tolerance required, and indirectly upon the layer build-up. When thickness tolerance T=±10%, obviously rejection ratio trends to zero.

FAQ: Do you sell rigid-flex PCB?
Sorry. We currently do not offer rigid-flex PCB.